Method of joining and method of fabricating an organic light emitting diode display device using the same

ABSTRACT

A method of joining a flexible layer and a support includes forming a first metal layer on one surface of the flexible layer, forming a second metal layer on one surface of the support, cleaning the first metal layer and the second metal layer, and joining the first metal layer to the second metal layer, such that the first metal layer is between the flexible layer and the second metal layer.

CROSS-REFERENCE TO RELATED APPLICATION

The present application is a related application of a co-pending U.S.patent application Ser. No. 12/137,353, entitled Organic Light EmittingDiode Display Device and Method of Fabricating the Same, which was filedon Jun. 11, 2008, and is incorporated by reference herein in itsentirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

Embodiments of the present invention relate to a method of joining andto a method of fabricating an organic light emitting diode (OLED)display device. More particularly, embodiments of the present inventionrelate to a method of joining a flexible layer and a support by usingmetal therebetween and to a method of fabricating an OLED display deviceusing the same.

2. Description of the Related Art

Flexible flat panel display devices, e.g., an OLED display device, referto display devices that may bend to a certain extent by applying apredetermined tension, thereby adjusting a viewing angle. Flexible flatpanel display devices may include stationary or portable devices, e.g.,devices in arm-bands, wallets, notebook computers, and so forth.

A conventional flexible flat panel display device may include a flexiblesubstrate. During fabrication of the conventional flexible flat paneldisplay device, a support may be attached to the flexible substrate viaan organic adhesive to control the flexible substrate. The organicadhesive between the flexible substrate and the support, however, maycause contamination during the manufacturing process of the flexibleflat panel display device, e.g., contamination of a process chamber, soprocessing time may be increased due to required cleaning, e.g., of thecontaminated process chamber. In addition, use of the organic adhesivemay limit a process temperature to about 300° C. or less. Further,uniform application of the organic adhesive between the flexiblesubstrate and the support may be difficult, so the flexible substrateand the support may not be uniformly adhered to each other.

SUMMARY OF THE INVENTION

Embodiments of the present invention are therefore directed to a methodof joining and to a method of fabricating an OLED display device, whichsubstantially overcome one or more of the disadvantages of the relatedart.

It is therefore a feature of an embodiment of the present invention toprovide a method of joining a flexible layer to a support via metal in asimplified process.

It is another feature of an embodiment of the present invention toprovide a method of joining a flexible layer to a support via metal witha high process yield.

It is yet another feature of an embodiment of the present invention toprovide a method of joining a flexible layer to a support via metal withreduced production costs.

It is still another feature of an embodiment of the present invention toprovide a method of joining a flexible layer to a support via metalwhile exhibiting reduced temperature dependency.

It is yet another feature of an embodiment of the present invention toprovide a method of fabricating an OLED display device by using a methodof joining a flexible substrate to a support having one or more of theabove features.

At least one of the above and other features and advantages of thepresent invention may be realized by providing a method of joining aflexible layer and a support, including forming a first metal layer onone surface of the support, forming a second metal layer on one surfaceof the flexible layer, cleaning the first metal layer and the secondmetal layer, and joining the second metal layer to the first metallayer, such that the second metal layer is between the flexible layerand the first metal layer.

Cleaning the first and second metal layers may include a first cleaningstep, the first cleaning step including drying the first and secondmetal layers after immersion thereof in a cleaning fluid, a secondcleaning step, the second cleaning step including cleaning the first andsecond metal layers via a D-sonic process or a rinsing process indeionized water, and a third cleaning step, the third cleaning stepbeing substantially similar to the first cleaning step. The first andsecond metal layers may be formed of one or more of iron, nickel, tin,zinc, chromium, cobalt, silicon, magnesium, titanium, zirconium,aluminum, silver, copper, and an alloy thereof. Joining the first andsecond metal layers may include a first joining process, the firstjoining process including positioning the first and second metal layersadjacent to each other at room temperature, an intermediate cleaningprocess, the intermediate cleaning process including cleaning the firstand second metal layers via a D-sonic process or a rinsing process indeionized water, and drying the first and second metal layers usingisopropyl alcohol, and a second joining process, the second joiningprocess including pressing and annealing the first and second metallayers to each other.

The method may further include treating the first and second metallayers with hydrogen fluoride after the cleaning and before the joining.Cleaning the first and second metal layers may include a first cleaningstep, the first cleaning step including drying the first and secondmetal layers after immersion thereof in a cleaning fluid, a secondcleaning step, the second cleaning step including cleaning the first andsecond metal layers via a D-sonic process or a rinsing process indeionized water, and a third cleaning step, the third cleaning stepbeing substantially similar to the first cleaning step. The first andsecond metal layers may be formed of one or more of iron, nickel, tin,zinc, chromium, cobalt, silicon, magnesium, titanium, zirconium,aluminum, silver, copper, and an alloy thereof. Joining the first andsecond metal layers may include a first joining process, the firstjoining process including positioning the first and second metal layersadjacent to each other at room temperature and a second joining process,the second joining process including pressing and annealing the firstand second metal layers to each other.

At least one of the above and other features and advantages of thepresent invention may be realized by providing a method of joining amethod of fabricating an OLED display device, including forming a firstmetal layer on one surface of the support, forming a second metal layeron one surface of the flexible layer, cleaning the first metal layer andthe second metal layer, joining the second metal layer to the firstmetal layer, such that the second metal layer is between the flexiblelayer/and the first metal layer; forming an OLED on the flexible layer,such that the flexible layer is between the OLED and the support, theOLED including a first electrode, an organic layer having an emittinglayer, and a second electrode, and removing the support with the firstand second metal layers.

Cleaning the first and second metal layers may include a first cleaningstep, the first cleaning step including drying the first and secondmetal layers after immersion thereof in a cleaning fluid, a secondcleaning step, the second cleaning step including cleaning the first andsecond metal layers via a D-sonic process or a rinsing process indeionized water, and a third cleaning step, the third cleaning stepbeing substantially similar to the first cleaning step. The first andsecond metal layers may be formed of one or more of iron, nickel, tin,zinc, chromium, cobalt, silicon, magnesium, titanium, zirconium,aluminum, silver, copper, and an alloy thereof. Joining the first andsecond metal layers may include a first joining process, the firstjoining process including positioning the first and second metal layersadjacent to each other at room temperature, an intermediate cleaningprocess, the intermediate cleaning process including cleaning the firstand second metal layers via a D-sonic process or a rinsing process indeionized water, and drying the first and second metal layers usingisopropyl alcohol, and a second joining process, the second joiningprocess including pressing and annealing the first and second metallayers to each other. Each of the first and second metal layers may beformed to a thickness of about 1,000 angstroms to about 10,000angstroms.

The method may further include treating the first and second metallayers with hydrogen fluoride after the cleaning and before the joining.Cleaning the first and second metal layers may include a first cleaningstep, the first cleaning step including drying the first and secondmetal layers after immersion thereof in a cleaning fluid, a secondcleaning step, the second cleaning step including cleaning the first andsecond metal layers via a D-sonic process or a rinsing process indeionized water, and a third cleaning step, the third cleaning stepbeing substantially similar to the first cleaning step. Each of thefirst and second metal layers may be formed to a thickness of about1,000 angstroms to about 10,000 angstroms. The first and second metallayers may be formed of one or more of iron, nickel, tin, zinc,chromium, cobalt, silicon, magnesium, titanium, zirconium, aluminum,silver, copper, and an alloy thereof. Joining the first and second metallayers may include a first joining process, the first joining processincluding positioning the first and second metal layers adjacent to eachother at room temperature and a second joining process, the secondjoining process including pressing and annealing the first and secondmetal layers to each other.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features and advantages of the present inventionwill become more apparent to those of ordinary skill in the art bydescribing in detail exemplary embodiments thereof with reference to theattached drawings, in which:

FIGS. 1A-1C illustrate cross-sectional views of sequential stages in amethod of joining a flexible layer to a support according to anembodiment of the present invention; and

FIGS. 2A-2E illustrate cross-sectional views of sequential stages in amethod of fabricating an OLED display device according to an embodimentof the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Korean Patent Application No. 10-2007-0072199, filed on Jul. 19, 2007,in the Korean Intellectual Property Office, and entitled: “JoiningMethod and Method of Fabricating Organic Light Emitting Diode DisplayDevice Using the Same,” is incorporated by reference herein in itsentirety.

Embodiments of the present invention will now be described more fullyhereinafter with reference to the accompanying drawings, in whichexemplary embodiments of the invention are illustrated. Aspects of theinvention may, however, be embodied in different forms and should not beconstrued as limited to the embodiments set forth herein. Rather, theseembodiments are provided so that this disclosure will be thorough andcomplete, and will fully convey the scope of the invention to thoseskilled in the art.

In the figures, the dimensions of layers, elements, and regions may beexaggerated for clarity of illustration. It will also be understood thatwhen a layer or element is referred to as being “on” another layer,element, or substrate, it can be directly on the other layer, element,or substrate, or intervening layers and/or elements may also be present.Further, it will also be understood that when a layer or element isreferred to as being “between” two layers or elements, it can be theonly layer or element between the two layers or elements, or one or moreintervening layers and/or elements may also be present. In addition, itwill be understood that when an element is referred to as being“connected” or “coupled” to another element, it can be directlyconnected or coupled to the other element or intervening elements may bepresent. In contrast, when an element is referred to as being “directlyconnected” or “directly coupled” to another element, there are nointervening elements present. Like reference numerals refer to likeelements throughout.

As used herein, the expressions “at least one,” “one or more,” and“and/or” are open-ended expressions that are both conjunctive anddisjunctive in operation. For example, each of the expressions “at leastone of A, B, and C,” “at least one of A, B, or C,” “one or more of A, B,and C,” “one or more of A, B, or C” and “A, B, and/or C” includes thefollowing meanings: A alone; B alone; C alone; both A and B together;both A and C together; both B and C together; and all three of A, B, andC together. Further, these expressions are open-ended, unless expresslydesignated to the contrary by their combination with the term“consisting of.” For example, the expression “at least one of A, B, andC” may also include an nth member, where n is greater than 3, whereasthe expression “at least one selected from the group consisting of A, B,and C” does not.

FIGS. 1A-1C illustrate cross-sectional views of sequential stages in amethod of joining a flexible layer to a support according to anembodiment of the present invention. For example, the flexible layer mayfunction as a flexible substrate in a flexible flat panel displaydevice, e.g., an OLED display device.

Referring to FIG. 1A, a support 10 and a flexible layer 20 may beprovided. The support 10 may have a predetermined strength to facilitatecontrol of the flexible layer 20 during subsequent processes. Thesupport 10 may be formed of, e.g., one or more of metal, glass, silicon,and quartz.

The flexible layer 20 may have excellent thermal stability, and may beformed of a material exhibiting characteristics of a diffusion barrierwith respect to moisture and oxygen. For example, the flexible layer 20may be formed of plastic, stainless steel (STS), thin metal film, and/orultra-thin glass. The flexible layer 20 may have a thickness of about0.1 mm or less.

Referring to FIG. 1B, a first metal layer 31 may be formed on a surfaceof the support 10 to form a first stacked structure. Similarly, a secondmetal layer 32 may be formed on a surface of the flexible layer 20 toform a second stacked structure. The first and second metal layers 31and 32 may be formed by any suitable method.

Formation of the first and second metal layers 31 and 32 on the support10 and flexible layer 20, respectively, may substantially minimizesurface roughness of the support 10 and flexible layer 20, so adhesionbetween the support 10 and flexible layer 20 in subsequent processes maybe improved. In other words, the first and second metal layers 31 and 32may prevent or substantially minimize non-uniform joining of the support10 and the flexible layer 20 by minimizing surface roughness thereof.Also, the first and second metal layers 31 and 32 may be formed onrespective surfaces of the support 10 and the flexible layer 20, i.e.,surfaces facing one another, so grinding the respective surfaces of thesupport 10 and the flexible layer 20 may be substantially omitted duringjoining of the support 10 and the flexible layer 20 in subsequentprocesses.

Each of the first and second metal layers 31 and 32 may have a thicknessof about 1,000 angstroms to about 10,000 angstroms, e.g., about 1,000angstroms. A metal layer having a thickness that is too low may havepoor surface roughness, so joining of the support 10 and the flexiblelayer 20 may be difficult. A metal layer having a thickness that is toothick, may damage the flexible layer 20 due to non-reversible forcegenerated during detachment of the support 10 and the flexible layer 20.Therefore, a thickness of about 1,000 angstroms to about 10,000angstroms of the first and second metal layers 31 and 32 may provideuniform attachment between the support 10 and the flexible layer 20 insubsequent processes despite the surface roughness of the support 10 andthe flexible layer 20. Thus, excessive production cost and time may beprevented.

Each of the first and second metal layers 31 and 32 may be formed of amaterial having a low melting point in order to facilitate a directjoining between the support 10 and the flexible layer 20, e.g., viaannealing, in a subsequent process. The first and second metal layers 31and 32 may include one or more of iron (Fe), nickel (Ni), tin (Sn), zinc(Zn), chromium (Cr), cobalt (Co), magnesium (Mg), titanium (Ti),zirconium (Zr), aluminum (Al), silver (Ag), copper (Cu), and an alloythereof.

Once the first and second metal layers 31 and 32 are formed on thesupport 10 and on the flexible layer 20, respectively, by-productsand/or foreign substances generated during formation of the first andsecond metal layers 31 and 32 may be removed by an initial cleaningprocess. The initial cleaning process may include one or more steps ofcleaning, e.g., immersing the first and second metal layers 31 and 32 inany suitable cleaning fluid, followed by drying. For example, theinitial cleaning process may include three cleaning steps. It is noted,however, that, e.g., a single-step initial cleaning process, two-stepinitial cleaning process, and so forth, are within the scope of thepresent invention.

In the first cleaning step of the initial cleaning process, by productsand foreign substances may be removed from the first and second metallayers 31 and 32 using, e.g., a stripper. For example, each of thesupport 10 with the first metal layer 31 and the flexible layer 20 withthe second metal layer 32 may be immersed in a cleaning fluid, e.g.,deionized (DI) water or an organic cleaning liquid, and may besubsequently dried using, e.g., isopropyl alcohol (IPA).

In the second cleaning step of the initial cleaning process, the firstand second metal layers 31 and 32 may be cleaned by a D-sonic method orby a rinsing method. The D-sonic method may include immersing each ofthe support 10 with the first metal layer 31 and the flexible layer 20with the second metal layer 32 in DI water, while cleaning via highfrequency sonic energy. The rinsing method may include rotating thesupport 10 with the first metal layer 31 and the flexible layer 20 withthe second metal layer 32, while spraying the support 10 with the firstmetal layer 31 and the flexible layer 20 with the second metal layer 32with DI water.

In the third cleaning step of the initial cleaning process, the firstand second metal layers 31 and 32 may be cleaned using, e.g., astripper. For example, each of the support 10 with the first metal layer31 and the flexible layer 20 with the second metal layer 32 may beimmersed in a cleaning fluid, e.g., deionized (DI) water or an organiccleaning liquid, and may be subsequently dried using, e.g., isopropylalcohol (IPA). The third cleaning step may be substantially the same asthe first cleaning step.

Once the initial cleaning process of the first and second metal layers31 and 32 is complete, each of the first and second metal layers 31 and32 may be annealed at a temperature of about 100° C. to about 140° C.The annealing process may completely remove the cleaning fluid used inthe initial cleaning process to clean the first and second metal layers31 and 32.

Referring to FIG. 1C, a joining process may be performed by joining thefirst and second stacked structures illustrated in FIG. 1B via the firstand second metal layers 31 and 32. In other words, outer surfaces of thefirst and second metal layers 31 and 32 may be joined, such that thesupport 10 and the flexible layer 20 may be connected via the first andsecond metal layers 31 and 32 to form, e.g., a multi-layered structure,as illustrated in FIG. 1C. The joining process may include first andsecond joining steps.

In the first joining step, the support 10 with the first metal layer 31and the flexible layer 20 with the second metal layer 32 may be placedin a class 100 clean room, such that the first metal layer 31 and thesecond metal layer 32 may be adjacent to each other. For example, thefirst and second metal layers 31 and 32 may be arranged in parallel andclose proximity to each other. It is noted that the class 100 clean roomrefers to a processing chamber maintaining a controlled environment interms of airborn particles and temperature, so the temperature ismaintained at about room temperature and the particles therein are in anamount of about one hundred particles in a 30×30×30 cm³ air space. Oncethe first and second metal layers 31 and 32 are arranged in the cleanroom, the first and second metal layers 31 and 32 may be joined by achemical bond, e.g., a weak hydrogen bond, to form a stacked structureof support 10/first metal layer 31/second metal layer 32/flexible layer20, as illustrated in FIG. 1C.

Once the first and second metal layers 31 and 32 are joined by the firstjoining step, the first and second metal layers 31 and 32 may be cleanedby an intermediate cleaning process in two cleaning steps. In the firststep of the intermediate cleaning process, the D-sonic or rinsing methoddescribed previously with reference to the second cleaning step of theinitial cleaning process may be used. In the second step of theintermediate cleaning process, the joined support 10 and flexible layer20 may be dried after the first step of the intermediate cleaningprocess using, e.g., IPA. By the first and second steps of theintermediate cleaning processes, water and bubbles adsorbed between thesurfaces of the first and second metal layers 31 and 32 may be removed.

Once the joined first and second metal layers 31 and 32 are cleaned anddried, the second joining step may be performed by pressing andannealing the first and second metal layers 31 and 32. While the firstand second metal layers 31 and 32 are weakly joined by a hydrogen bondin the first joining step, the second joining process may increase thebonding strength between the first and second metal layers 31 and 32. Inparticular, as joining density between the first and second metal layers31 and 32 is increased by applied heat and pressure, a distance betweenthe first and second metal layers 31 and 32 may decrease and a metallicbond may be formed between the first and second metal layers 31 and 32to directly join them together. Consequently, a distance between thesupport 10 and the flexible layer 20 after the second joining step maybe decreased at least about 5-fold, as compared to a distance betweenthe support 10 and the flexible layer 20 after the first joining stepand before the second joining step. For example, while a distancebetween the first and second metal layers 31 and 32 after the firstjoining step, i.e., due to the hydrogen bonding, may be about 20angstroms to about 30 angstroms, a distance between the first and secondmetal layers 31 and 32 after the second joining process, i.e., due tothe metal bonding, may be about 3 angstroms to about 4 angstroms.Therefore, joining strength may be also increased as compared to thejoining strength immediately after the first joining step.

In the second joining step, the pressure applied to the support 10 andthe flexible layer 20 may be in a range of about 0.1 MPa to about 50MPa. For example, the pressure may be about 0.5 MPa. A pressure aboveabout 50 MPa may damage the support 10 and the flexible layer 20, and apressure below about 0.1 MPa may be insufficient to provide highadhesion between the support 10 and the flexible layer 20. Further, inthe second joining step, an annealing temperature for optimizingpressure and strength of the adhesion between the support 10 and theflexible layer 20 may be about 200° C. to about 600° C., e.g., about400° C. to about 450° C. The annealing time may be about 0.5 hours toabout 2 hours, e.g., about 0.5 hours.

According to another embodiment of the present invention, a method ofjoining a flexible layer with a support may be substantially similar tothe method described previously with reference to FIGS. 1A-1C, with theexception of performing hydrogen fluoride (HF) treatment on the firstand second metal layers 31 and 32 after the initial cleaning process inorder to make outer surfaces of the first and second metal layers 31 and32 hydrophobic. Due to the HF treatment of the first and second metallayers 31 and 32, gases, e.g., oxygen, may be removed from the first andsecond metal layers 31 and 32, so the intermediate cleaning process forremoving bubbles and water may be omitted. Thus, the HF-treated firstand second metal layers 31 and 32 may be joined by a chemical bondthrough the first joining process, as described previously withreference to FIG. 1C, and may be directly joined by a metallic bondhaving a high adhesion in the second joining process, as furtherdescribed with reference to FIG. 1C.

According to another embodiment illustrated in FIGS. 2A-2E, a method offabricating an OLED display device may include joining the support 10and the flexible layer 20. A method of joining the support 10 and theflexible layer 20 may be either of the methods described previously,e.g., with reference to FIGS. 1A-1C.

Referring to FIG. 2A, the flexible layer 20 may be formed on the support10, such that the first and second metal layers 31 and 32 may betherebetween. The method of joining the support 10 to the flexible layer20 may be substantially similar to the method described previously,e.g., with reference to FIGS. 1A-1C, and therefore will not be repeated.

Referring to FIG. 2B, an OLED 100 may be formed on the flexible layer20, such that the flexible layer 20 may be between the OLED 100 and thesupport 10. The OLED 100 may include a first electrode 110, an organiclayer 120, and a second electrode 130 formed sequentially on theflexible layer 20, as further illustrated in FIG. 2B. A thin filmtransistor (not shown), a capacitor (not shown), or an insulating layer(not shown) may be further included between the first electrode 110 andthe flexible layer 20.

The first electrode 110 may have a double-structure or atriple-structure to include a reflective layer. For example, if thefirst electrode 110 has a double-structure, the first electrode 110 mayinclude a sequentially stacked reflective layer, e.g., a layer includingaluminum (Al), silver (Ag), or an alloy thereof, and a transparentconductive layer, e.g., a layer including indium-tin-oxide (ITO),indium-zinc-oxide (IZO), indium-tin-zinc-oxide (ITZO), or a combinationthereof. In another example, if the first electrode 110 has atriple-structure, the first electrode 110 may include a sequentiallystacked first metal layer, e.g., a layer including titanium (Ti),molybdenum (Mo), ITO, or an alloy thereof, a reflective layer, e.g., alayer including Al, Ag, or an alloy thereof, and a transparentconductive layer, e.g., a layer including ITO, IZO, ITZO, or acombination thereof.

The organic layer 120 may include an organic light emitting layer. Theorganic light emitting layer may include one or more of a white emittinglayer, a red emitting layer, a green emitting layer, and a blue emittinglayer. Further, the organic layer 120 may include at least one of a holeinjection layer, a hole transport layer, an electron injection layer, anelectron transport layer, and a hole blocking layer. The organic layer120 may be formed by, e.g., vacuum deposition, ink-jet printing, orlaser induced thermal imaging (LITI).

If the organic layer 120 includes a white emitting layer, the whiteemitting layer may be a single layer or a multi-layer. When the whiteemitting layer is a single layer, white light may be emitted by mixingmaterials emitting different colors with different dopants. For example,white emitting layer having a single layer may include PBD, TPB,Coumarin 6, DCM1, and Nile red with a carbazole molecule, i.e., PVK, atan appropriate ratio. Alternatively, white light may be emitted bymixing two different color-emitting materials and adding the remainingemitting material thereto. For example, a white emitting layer having asingle layer may include a red emitting material mixed with a greenemitting material, followed by addition of a blue emitting material. Thered emitting material may be formed of a polymer, e.g., polythiophene(PT) and derivatives thereof, the green emitting material may be formedof low-molecular materials, e.g., an aluminum quinoline complex (Alq₃),BeBq₂, and/or Almq, and/or a polymer, e.g., poly(p-phenylenevinylene)(PPV) and derivatives thereof, and the blue emitting material may beformed of low-molecular materials, e.g., ZnPBO, Balq, DPVBi and OXA-D,and/or polymers, e.g., polyphenylene (PPP) and derivatives thereof.

When the white emitting layer is a multi-layer, the white emitting layermay be formed to include, e.g., two layers emitting light in differentwavelength regions. For example, one layer, e.g., a phosphorescentemitting layer, may emit light in an orange-red region and anotherlayer, e.g., a fluorescent emitting layer, may emit light in a blueregion. It is noted that the phosphorescent emitting layer may haveexcellent emission characteristics, as compared with a fluorescentemitting layer emitting light in a substantially same wavelength range,while the fluorescent emitting layer may have better lifetimecharacteristics than the phosphorescent emitting layer. Thus, the whiteemitting layer formed by stacking the phosphorescent emitting layeremitting light in the orange-red region and the fluorescent emittinglayer emitting light in the blue region may have excellent luminousefficiency and long lifetime. Also, the white emitting layer may be adouble layer formed of a polymer, a low-molecular material, and/or acombination thereof.

When the white emitting layer is a multi-layer, the white emitting layermay have a triple structure. For example, the white emitting layer mayinclude a red emitting layer, a green emitting layer, and a blueemitting layer. The red, green, and blue emitting layers may emit lightsof respective colors, and may be stacked in any order. The red emittinglayer may be formed of a low molecular material, e.g., Alq₃ (host)/DCJTB(fluorescent dopant), Alq₃ (host)/DCM (fluorescent dopant), or CBP(host)/PtOEP (phosphorescent organic metal complex), or of a polymer,e.g., a PFO series polymer. The green emitting layer may be formed of alow molecular material, e.g., Alq₃, Alq₃ (host)/C545t (dopant), or CBP(host)/IrPPY (phosphorescent organic material complex), or of a polymer,e.g., PFO series polymer or a PPV series polymer. The blue emittinglayer may include a host and a dopant, wherein the host may include oneor more of an amine series compound, e.g., TMM-004(COVION),3-(4-tert-butylphenyl)-4-phenyl-5-(4-biphenylspiro)-6P, a PFO seriespolymer, and a PPV series polymer, and the dopant may include one ormore of distyrylbenzene (DSB), distyrylarylene (DSA),bis[2-(4,6-difluorophenyl)pyridinato-N,C2′]iridium picolinate (F2Irpic),and tris[1-(4,6-difluorophenyl)pyrazolate-N,C2′]iridium (Ir[dfppz]₃).

The hole injection layer of the organic layer 120 may facilitate holeinjection into the organic emitting layer of the organic layer 120, andmay increase the lifetime of the OLED 100. The hole injection layer maybe formed of an arylamine series compound or starburst amines, andexamples of hole injection layer materials may include one or more of4,4,4-tris(3-methylphenylamino)triphenylamine (m-MTDATA),1,3,5-tris[4-(3-methylphenylamino)phenyl]benzene (m-MTDATB), and copperphthalocyanine (CuPc).

The hole transport layer of the organic layer 120 may be formed of anarylene diamine derivative, a starburst compound, a biphenyl diaminederivative having a spiro group, or a trapezoidal compound. Examples ofmaterials used to form the hole transport layer may include one or moreof N,N-diphenyl-N,N-bis(4-methylphenyl)-1,1-biphenyl-4,4-diamine (TPD)or 4,4-bis[N-(1-naphthyl)-N-phenylamino]biphenyl (NPB).

The hole blocking layer of the organic layer 120 may prevent transfer ofa hole into the electron injection layer when hole mobility is greaterthan electron mobility in the organic emitting layer. The hole blockinglayer may be formed of, e.g.,2-biphenyl-4-yl-5-(4-biphenyl)-1,2,4-triazole (TAZ).

The electron transport layer may be formed of a metal compound that mayreceive an electron from a cathode electrode and stably transfer theelectron, e.g., e.g., Alq₃. The electron injection layer may be formedof, e.g., one or more of 1,3,4-oxyldiazole derivatives, 1,2,4-triazolederivatives, and LiF.

The second electrode 130 of the OLED 100 may be a semi-transmissiveelectrode, and may be formed of, e.g., magnesium silver (MgAg) oraluminum silver (AlAg). For example, MgAg may be formed by co-depositionof Mg and Ag, and AlAg may be formed by sequentially depositing Al andAg. Further, a transparent conductive layer, e.g., ITO or IZO, may befurther formed on the second electrode 130.

Referring to FIG. 2C, an encapsulation substrate 200 may be formed onthe flexible layer 20 to surround the OLED 100, such that the OLED 100may be completely enclosed from an exterior. In other words, theencapsulation substrate 200 may protect the OLED 100 from moistureand/or external air. The encapsulation substrate 200 may be formed oftransparent glass or plastic to transmit light emitted from the OLED100. The encapsulation substrate 200 and the flexible layer 20 may beadhered by a sealant or a frit.

Referring to FIG. 2D, once the OLED 100 is enclosed between the flexiblelayer 20 and the encapsulation substrate 200, the flexible layer 20 maybe detached from the support 10 using detachment equipment 300, e.g., arazor blade. As illustrated in FIG. 2D, the detachment equipment 300 maybe used along an interface between the flexible layer 20 and the secondmetal layer 32, so the support 10 and the first and second metal layers131 and 132 may be completely removed.

Accordingly, as illustrated in FIG. 2E, the support 10 and the flexiblelayer 20 are separated from each other. Thus, an OLED display deviceaccording to an exemplary embodiment of the present invention mayinclude a flexible substrate, i.e., the flexible layer 20.

Embodiments of the present invention may be advantageous in providing amethod of joining a flexible layer to a support by using metal layerstherebetween. Use of the metal layers may eliminate use of an organicadhesive, so organic contamination may be eliminated and temperaturedependency may be reduced. Further, use of the metal layers may minimizesurface roughness of the flexible layer and the support, so uniformityadhesion and strength between the flexible layer and the support may beincreased. As such, manufacturing time and costs may be reduced, whilemanufacturing yield may be increased. Further the manufacturing processmay be simplified. Accordingly, manufacturing of an OLED display devicewith a flexible substrate according to embodiments of the presentinvention may be substantially improved in terms of manufacturingprocess and costs.

Exemplary embodiments of the present invention have been disclosedherein, and although specific terms are employed, they are used and areto be interpreted in a generic and descriptive sense only and not forpurpose of limitation. Accordingly, it will be understood by those ofordinary skill in the art that various changes in form and details maybe made without departing from the spirit and scope of the presentinvention as set forth in the following claims.

1. A method of fabricating an organic light emitting diode (OLED) display device, comprising: forming a first metal layer on one surface of a support; forming a second metal layer on one surface of a flexible layer; cleaning the first metal layer and the second metal layer; joining the second metal layer to the first metal layer, such that the second metal layer is between the flexible layer and the first metal layer; forming an OLED on the flexible layer, such that the flexible layer is between the OLED and the support, the OLED including a first electrode, an organic layer having a light emitting layer, and a second electrode; and removing the support with the first and second metal layers.
 2. The method as claimed in claim 1, wherein cleaning the first and second metal layers includes: a first cleaning step, the first cleaning step including drying the first and second metal layers after immersion thereof in a cleaning fluid; a second cleaning step, the second cleaning step including cleaning the first and second metal layers via a D-sonic process or a rinsing process in deionized water; and a third cleaning step, the third cleaning step being substantially same as the first cleaning step.
 3. The method as claimed in claim 1, wherein the first and second metal layers are formed of one or more of iron, nickel, tin, zinc, chromium, cobalt, silicon, magnesium, titanium, zirconium, aluminum, silver, copper, and an alloy thereof.
 4. The method as claimed in claim 1, wherein joining the first and second metal layers includes: a first joining process, the first joining process including positioning the first and second metal layers adjacent to each other at room temperature; an intermediate cleaning process, the intermediate cleaning process including cleaning the first and second metal layers via a D-sonic process or a rinsing process in deionized water, and drying the first and second metal layers using isopropyl alcohol; and a second joining process, the second joining process including pressing and annealing the first and second metal layers to each other.
 5. The method as claimed in claim 1, wherein each of the first and second metal layers is formed to a thickness of about 1,000 angstroms to about 10,000 angstroms.
 6. The method as claimed in claim 1, further comprising treating the first and second metal layers with hydrogen fluoride after the cleaning.
 7. The method as claimed in claim 6, wherein cleaning the first and second metal layers includes: a first cleaning step, the first cleaning step including drying the first and second metal layers after immersion thereof in a cleaning fluid; a second cleaning step, the second cleaning step including cleaning the first and second metal layers via a D-sonic process or a rinsing process in deionized water; and a third cleaning step, the third cleaning step being substantially same as the first cleaning step.
 8. The method as claimed in claim 6, wherein each of the first and second metal layers is formed to a thickness of about 1,000 angstroms to about 10,000 angstroms.
 9. The method as claimed in claim 6, wherein the first and second metal layers are formed of one or more of iron, nickel, tin, zinc, chromium, cobalt, silicon, magnesium, titanium, zirconium, aluminum, silver, copper, and an alloy thereof.
 10. The method as claimed in claim 6, wherein joining the first and second metal layers includes: a first joining process, the first joining process including positioning the first and second metal layers adjacent to each other at room temperature; and a second joining process, the second joining process including pressing and annealing the first and second metal layers to each other. 